Engineering Assembly Tech

Location: San Jose, CA
Primary Responsibility will be to support New Product development and assembly of engineering prototype builds for San Jose Product Development Teams.

Tasks include:
  • Work with Engineers on Multi-Chip Module (MCM) product assembly and development
  • Create auto wire bond programs and loop profiles for testing and qualification of MCM product designs
  • Conduct Design Of Experiment (DOE) to evaluate Gold and Copper bonding
  • Wire bond process characterization and optimization to achieve desired test performance and wire bond specification. Record and document results for repeatability and production readiness
  • Responsible for wire bond machine setup, parameter settings, process verification, and maintenance
  • Support other assembly operations like stencil screen printer, reflow oven, surface mount, auto die attach and dicing saw as needed
  • Perform manual die pick and placement using tweezers or pickup tools, epoxy / DAF attach on MCMs. These tasks are a combination of manual assembly and equipment operation and involve working with the aid of a microscope and tools for handling very small parts for prototyping
  • Support customized build request, mount MCMs on evaluation boards by solder attach. Perform manual soldering, attach passive components, perform rework on boards, change components, mount dies, and prepare for wire bonding

Candidate must be able to work from schematics, diagrams, written and verbal descriptions, layouts or defined plans to perform assembly functions. Candidate must know how to interpret builds and BOM (Bill of Material). A basic understanding of electronic circuits is required. Must be proficient using hand tools such as tweezers, picks, vacuum pencils. Understanding die bonding, wire bonding, flip chip assembly and test fixtures is also desired.

Candidate should take an active role in the building of new products, participating in meetings, and being a team player. This position requires a self-motivated team player with a strong desire to succeed. Must have team-oriented attitude, accountability, and ownership.

Job Requirements :
  • Associates or equivalent years of experience 6+ years.
  • Strong experience in wire bond process technology, K&S auto bonder programming, operation and maintenance
  • Very good understanding of gold and copper wire bonding on MCM substrates
  • Work from Schematic drawings for assembly builds and follow specifications for qualification of new designs
  • Experience with hand tools (e.g., Tweezers, Vacuum pickup tools, Soldering Irons, die handling, test fixtures)
  • Experience with computers using Microsoft excel, word, and Microsoft Outlook

Preferred Skills :
  • Stencil screen print, SMT, manual die attach, wire bonding, dicing saw, soldering and printed circuit assembly experience, working from engineering drawings, and markups.
  • Trained to handle ESD sensitive electronic components, and experience working with the aid of a microscope.
Matt Rubin
ProEnlist, LLC
720-845-6562 Direct
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